At a glance

• Role: Packaging & materials lead—molded assemblies, CG (center of gravity) and ballast, gasket strategy, PCB–mechanical integration

• Scope: Collaboration with EE/sensing; lab prep and field readiness; rapid iteration

• Outcome: Improved in-water stability and recording endurance; repeatable molding process; buoyancy/pressure checks passed

Three proof points

• Packaging: Low-profile housing with a serviceable seal stack and strain-relieved cable routing

• Balance: CG tuning with a ballast map for consistent orientation and reduced drag

• Validation testing: Buoyancy-tank and pressure-pot checks; attachment strategy exercised for deploy/retrieval

NDA note:Client identities and proprietary geometry are withheld under NDA. Methods and outcomes only.